Electronics, Packaging, Assembly and Test (EPAT) Overview

As the leading industrial and specialty gas supplier to the Electronics Industry, Air Products is meeting the needs and surpassing the expectations not only of the semiconductor manufacturers, but also those engaged in semiconductor packaging, PCB assembly, and other emerging technologies.

Air Products' Electronics Packaging, Assembly and Test (EPAT) Applications Team is dedicated to assisting such customers use our industrial and specialty gases to improve product quality, enhance system reliability, reduce rework, reduce total cost of ownership and accomplish this in the safest possible manner.

Our global team of researchers, engineers and technicians combines both industry and gas systems experience to effectively develop and apply gas technologies to a wide spectrum of processes and industries. Our technical experience is kept on the leading-edge through on-going in-house research and joint development projects with customers, universities and consortiums.

Our team implements industrial gas systems for such traditional processes as inert and reactive atmosphere soldering, eutectic die attach, hybrid manufacturing, plasma etching and thermal shock/cycling testing and such emerging technologies as 3-D or Stacked IC packaging, photovoltaic processes and fiber optics. This technical support helps customers optimize their industrial gas system performance, as well as improve their processes, lower their production costs, and resolve process-related problems.

Following are some of the applications supported by this team: